KBP Epoxy LM

Low Modulus Epoxy resin meets most DOT specifications for thin bonded overlays and HFST View Projects

KBP Epoxy LM is a low modulus, epoxy resin binder system designed primarily for
use as a protective wearing course for concrete bridge decks as well as a binder system for High Friction Surface Treatments (HFST).

Features

Simple

Easy to specify, easy to apply

Effective

Low permeability of the material protects against future intrusion of moisture and chlorides.

Versatile

Simple 1:1 mixing ratio allows usage with many existing types of epoxy equipment. Similar viscosity of parts A and B ensure ease of mixing.

 

Physical Properties
Mix Ratio 1:1
Chloride Ion Permeability AASHTO T277 0 coulombs
Bond Strength ASTM C1583 > 250 psi
Viscosity 1400-1800 cps
ASTM D-638 Tensile Elongation at Break 50-60%
ASTM D-638 Tensile Strength 2800-3200 psi