KBP Epoxy LM

Low Modulus Epoxy resin meets most DOT specifications for thin bonded overlays and HFST View Projects

KBP Epoxy LM is a low modulus, epoxy resin binder system designed primarily for
use as a protective wearing course for concrete bridge decks as well as a binder system for High Friction Surface Treatments (HFST).



Easy to specify, easy to apply


Low permeability of the material protects against future intrusion of moisture and chlorides.


Simple 1:1 mixing ratio allows usage with many existing types of epoxy equipment. Similar viscosity of parts A and B ensure ease of mixing.


Physical Properties
Mix Ratio 1:1
Chloride Ion Permeability AASHTO T277 0 coulombs
Bond Strength ASTM C1583 > 250 psi
Viscosity 1400-1800 cps
ASTM D-638 Tensile Elongation at Break 50-60%
ASTM D-638 Tensile Strength 2800-3200 psi