KBP Epoxy LM

Low Modulus Epoxy resin meets most DOT specifications for Thin Polymer Overlays and HFST

KBP Epoxy LM

KBP Epoxy LM is a low modulus, epoxy resin binder system designed primarily for use as a protective wearing course for concrete bridge decks as well as a binder system for High Friction Surface Treatments (HFST).

When used as a bridge deck overlay, Epoxy LM is typically most successful for bridges:

  • in areas with low ADT
  • with low thermal movements
  • with a short span length
  • in moderate installation temperatures




Easy to specify, easy to apply. 


Low permeability of the material protects against future intrusion of moisture and chlorides.


Simple 1:1 mixing ratio allows usage with many existing types of epoxy equipment. Similar viscosity of parts A and B ensure ease of mixing.

Physical Properties

Mix Ratio 1:1
Chloride Ion
Permeability AASHTO T277
0 coulombs
Bond Strength ASTM C1583 > 250 psi
Viscosity 1400-1800 cps
ASTM D-638 Tensile Elongation
at Break
ASTM D-638 Tensile Strength 2800-3200 psi