KBP Epoxy LM
Low Modulus Epoxy resin meets most DOT specifications for Thin Polymer Overlays and HFST
KBP Epoxy LM is a low modulus, epoxy resin binder system designed primarily for use as a protective wearing course for concrete bridge decks as well as a binder system for High Friction Surface Treatments (HFST).
When used as a bridge deck overlay, Epoxy LM is typically most successful for bridges:
- in areas with low ADT
- with low thermal movements
- with a short span length
- in moderate installation temperatures
Easy to specify, easy to apply.
Low permeability of the material protects against future intrusion of moisture and chlorides.
Simple 1:1 mixing ratio allows usage with many existing types of epoxy equipment. Similar viscosity of parts A and B ensure ease of mixing.
Permeability AASHTO T277
|Bond Strength ASTM C1583||> 250 psi|
|ASTM D-638 Tensile Elongation
|ASTM D-638 Tensile Strength||2800-3200 psi|